Waterjet cutting system with standoff distance control
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United States of America Patent
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Apr 14, 2015
Issued Date -
N/A
app pub date -
Jul 29, 2011
filing date -
Jul 29, 2011
priority date (Note) -
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Abstract
A cutting head of a waterjet cutting system is provided having an environment control device and a measurement device. The environment control device is positioned to act on a surface of a workpiece at least during a measurement operation to establish a measurement area on the surface of the workpiece substantially unobstructed by fluid. The measurement device is positioned to selectively obtain information from within the measurement area indicative of a position of the cutting head relative to the workpiece. A control system is further provided and operable to position the cutting head relative to the workpiece at a standoff distance based at least in part on the information indicative of the position of the cutting head relative to the workpiece obtained by the measurement device. A method of operating a waterjet cutting system is also provided.
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