Heat sink assembly for electronic components
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United States of America Patent
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Nov 25, 2014
Issued Date -
N/A
app pub date -
Jul 29, 2011
filing date -
Jul 29, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
One aspect of the disclosure is directed to a heat sink assembly for dissipating heat from an electronic component. The heat sink assembly includes a heat sink having a base and at least one fin extending from the base. The at least one fin has an opening formed therein that is configured to receive a fastener. The heat sink assembly also includes a clip. The clip has a first portion configured to receive the fastener and at least one second portion flexibly coupled to the first portion. The at least one second portion is configured to secure the heat sink to the electronic component proximate to the base in response to a force being applied to the first portion by the fastener.
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