THERMAL SUBSTRATE
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United States of America Patent
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N/A
Issued Date -
Jan 31, 2013
app pub date -
Jul 25, 2011
filing date -
Jul 25, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An organic substrate capable of providing effective heat transfer through its entire thickness by the use of parallel, linear common thermally conductive openings that extend through the substrate, the substrate having thin dielectric layers bonded together to form an integral substrate structure. The structure is adapted for assisting in providing cooling of high temperature electrical components on one side by effectively transferring heat from the components to a cooling structure positioned on an opposing side. Methods of making the substrate are also provided, as is an electrical assembly including the substrate, component and cooling structure.
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