ELECTRON-BEAM EXPOSURE METHOD AND ELECTRON-BEAM EXPOSURE APPARATUS

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United States of America Patent

APP PUB NO 20130027683A1
SERIAL NO

13635590

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Abstract

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An effective region of the light-sensitive film to be exposed is divided in a radial direction of the substrate, into at least a first region, and a second region adjacent to the first region and provided at more outer peripheral side of the substrate than the first region, and a third region adjacent to the second region and provided at more outer peripheral side of the substrate than the second region, and the rotational speed of the substrate is varied during electron beam exposure of the second region, under a condition that the linear speed of the substrate is kept to be constant at the irradiation position of the electron beam; and the rotational speed of the substrate is varied during electron beam exposure of the first region and the third region, under a condition that the linear speed of the substrate is set to be slower respectively than the linear speed used in the second region.

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Patent Owner(s)

Patent OwnerAddress
HOYA CORPORATION6-10-1 NISHI-SHINJUKU SHINJUKU-KU SHINJUKU-KU TOKYO 160-8347

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yamashita, Hiroshi Shinjuku-ku, JP 461 11428

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