ACTIVE SOLDER
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United States of America Patent
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N/A
Issued Date -
Jan 31, 2013
app pub date -
Jul 27, 2011
filing date -
Jul 27, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An active solder is revealed. The active solder includes an active material and a metal substrate. There are two kinds of active materials, titanium together with rare earth elements and magnesium. The metal substrate is composed of a main component and an additive. The main component is tin-zinc alloy and the additive is selected from bismuth, indium, silver, copper or their combinations. The active solder enables targets and backing plates to be joined with each other directly in the atmosphere. The target is ceramic or aluminum with low wetting properties. The bonding temperature of the active solder ranges from 150° C. to 200° C. so that the problem of thermal stress can be avoided.
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