POLISHING SLURRY, POLISHING METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
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United States of America Patent
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app pub date -
Oct 1, 2012
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Mar 29, 2010
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Abstract
The present invention relates to a polishing slurry for performing chemical mechanical polishing on a surface to be polished including a surface made of silicon oxide and a surface made of metal, characterized in that it includes cerium oxide particles, a complexing agent, and water.
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