System for using active and passive cooling for high power thermal management

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United States of America Patent

PATENT NO 10006720
SERIAL NO

13195515

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Abstract

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A cooling system that includes a substrate having a metallic face, at least one microporous wick formation in thermal communication with the metallic face, and a liquid delivery head positioned in complementary opposition to the metallic face, the liquid delivery head having at least one nozzle for directing a liquid towards the metallic face.

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Patent Owner(s)

  • TELEDYNE SCIENTIFIC & IMAGING, LLC

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bhunia, Avijit Thousand Oaks, US 17 125
Cai, Qingjun Thousand Oaks, US 10 271
Chen, Chung-Lung Thousand Oaks, US 24 375

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