Integrated circuit with sensor and method of manufacturing such an integrated circuit
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United States of America Patent
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Feb 5, 2019
Grant Date -
Feb 7, 2013
app pub date -
Jul 24, 2012
filing date -
Aug 3, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed is an integrated circuit comprising a substrate (10) carrying a plurality of circuit elements; a metallization stack (12, 14, 16) interconnecting said circuit elements, said metallization stack comprising a patterned upper metallization layer comprising a first metal portion (20) and a second metal portion (21); a passivation stack (24, 26, 28) covering the metallization stack; a gas sensor including a sensing material portion (32, 74) on the passivation stack; a first conductive portion (38) extending through the passivation stack connecting a first region of the sensing material portion to the first metal portion; and a second conductive portion (40) extending through the passivation stack connecting a second region of the sensing material portion to the second metal portion. A method of manufacturing such an IC is also disclosed.
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