Microstructured device with embossed layer

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United States of America Patent

PATENT NO 10329429
APP PUB NO 20130034707A1
SERIAL NO

13198540

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Abstract

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A security device has a support substrate of a first material having a softening temperature t1 and an embossed layer of a second different material supported by the support substrate having a softening temperature t2, wherein t2

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Patent Owner(s)

Patent OwnerAddress
VIAVI SOLUTIONS INC1445 SOUTH SPECTRUM BLVD SUITE 102 CHANDLER AS 85286

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Argoitia, Alberto Santa Rosa, US 85 1845
Delst, Cornelis Jan Fairfax, US 63 134
Holden, Laurence Cranbury, US 13 88
O'Boyle, Lily Cream Ridge, US 14 257

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