Substrate Processing Apparatus
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United States of America Patent
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N/A
Issued Date -
Feb 14, 2013
app pub date -
Apr 14, 2011
filing date -
Apr 19, 2010
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A substrate processing apparatus for deposition on a water seated therein is disclosed. The substrate processing apparatus includes a chamber having a reaction space, a lid provided on the chamber to selectively open or close the reaction space, a main disc accommodated in the chamber, on which at least one wafer is placed, and a drive device including a drive shaft to selectively rotate the main disc and a drive unit to drive the drive shaft. The drive shaft is separably coupled to the main disc to transmit drive force. When the lid is opened to expose the reaction space, the main disc is separated from the drive shaft and is discharged to the outside of the chamber in a state in which the wafer is placed thereon.
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