HIGH DENSITY TRACE FORMATION METHOD BY LASER ABLATION
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United States of America Patent
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Issued Date -
Feb 14, 2013
app pub date -
Aug 10, 2011
filing date -
Aug 10, 2011
priority date (Note) -
Abandoned
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Abstract
A method for making a microelectronic substrate includes forming a pattern of a selected metallic layer of an in-process unit using laser ablation such that the pattern corresponds to desired locations for conductive features. Conductive material is than added to the in-process unit by a process that uses the pattern to concentrate application of the conductive material to the in-process unit such that the conductive material forms conductive features of the substrate according to the pattern. The step forming a pattern of a selected metallic layer of an in-process unit using laser ablation can includes the use of a UV laser, a CO2 or an excimer laser.
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