SEMICONDUCTOR LIGHT-EMITTING ELEMENT MOUNTING MODULE, SEMICONDUCTOR LIGHT-EMITTING ELEMENT MODULE, MANUFACTURING METHOD OF SEMICONDUCTOR LIGHT-EMITTING ELEMENT MOUNTING MODULE, AND MANUFACTURING METHOD OF SEMICONDUCTOR LIGHT-EMITTING ELEMENT MODULE
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United States of America Patent
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Issued Date -
Feb 14, 2013
app pub date -
Jul 20, 2012
filing date -
Jul 25, 2011
priority date (Note) -
Abandoned
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Abstract
A semiconductor light-emitting element mounting module includes a metal conductor plate including at least one connection surface formed on one side thereof, wherein a semiconductor light-emitting element is connectable to the connection surface; a pair of terminals provided away from the connection surface and which are connectable to the connection surface to be electrically conductive therewith; a surface-insulation portion formed from a resin material, wherein the surface-insulation portion covers the entire surface of the metal conductor plate except for the connection surface. The pair of terminals are connectable with a corresponding pair of terminals that are provided on another semiconductor light-emitting element mounting module.
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