METHOD OF CUTTING A MOTHER SUBSTRATE [as amended]
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United States of America Patent
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app pub date -
Oct 26, 2012
filing date -
Jul 16, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A mother substrate cutting apparatus which may include a stationary stage, a moving stage on the stationary stage, the moving stage being configured to move in a first direction, a guide bar on the stationary stage, the guide bar being connected to the stationary stage via posts and configured to extend above the moving stage in a second direction crossing the first direction, a moving unit at the guide bar, the moving unit being configured to move on the guide bar, a lifter on the moving unit, the lifter being configured to move in a third direction that crosses the first direction and the second direction, and a blade on the lifter, the blade being configured to rotate and cut the mother substrate on the moving stage.
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