STRUCTURE AND PROCESS OF HEAT DISSIPATION SUBSTRATE
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United States of America Patent
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Issued Date -
Feb 21, 2013
app pub date -
Nov 10, 2011
filing date -
Aug 19, 2011
priority date (Note) -
Abandoned
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Abstract
Structure of a heat dissipation substrate including a metal substrate, a first insulating material, a second insulating material, a first patterned conductive layer and a second patterned conductive layer is provided. The metal substrate has an upper surface and a lower surface opposite to each other, a plurality of first recesses located on the upper surface and a plurality of second recesses located on the lower surface. The first insulating material is provided to fill into the first recesses. The second insulating material is provided to fill into the second recesses. The first patterned conductive layer is disposed on the upper surface of the metal substrate and a portion of the first insulating material. The second patterned conductive layer is disposed on the lower surface of the metal substrate and a portion of the second insulating material.
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