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Abstract

A damping composition for a vibrational damping layer is provided, including about 5 to about 40 weight percent butyl rubber and about 4 to about 12 weight percent ethylene copolymer. In one embodiment, the damping composition can include about 10 to about 30 weight percent butyl rubber, about 4 to about 12 weight percent ethylene vinyl acetate about 10 to about 40 weight percent filler, about 5 to about 15 weight percent plasticizer, about 2 to about 30 weight percent tackifier, and about 1 to about 10 weight percent adhesion promoter. A damping system is also provided, including a base blank, a constraining layer, and a damping layer, wherein the damping layer comprises from about 5 to about 40 weight percent of a butyl rubber, and is in contact with and positioned in between the base blank and the constraining layer.

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First Claim