Solder Bump Bonding In Semiconductor Package Using Solder Balls Having High-Temperature Cores
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United States of America Patent
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Issued Date -
Feb 21, 2013
app pub date -
Aug 15, 2011
filing date -
Aug 15, 2011
priority date (Note) -
Abandoned
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Abstract
A semiconductor die is solder bump-bonded to a leadframe or circuit board using solder balls having cores made of a material with a melting temperature higher than the melting temperature of the solder to ensure that in the finished structure the die is parallel to the leadframe or circuit board.
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