HIGH FREQUENCY CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Feb 28, 2013
app pub date -
Aug 30, 2011
filing date -
Aug 30, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
In one embodiment of the present invention, a high frequency circuit board includes a laminate having a top surface with a groove; a semi-rigid cable positioned in the groove of the laminate; and a passivation layer filling the groove; wherein the semi-rigid cable is configured to transmit a high frequency signal, and the semi-rigid cable comprises a central conductor, an outer conductor, and an insulating layer between the central conductor and the outer conductor.
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