SUBSTRATE WITH SPRING TERMINAL AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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N/A
Issued Date -
Feb 28, 2013
app pub date -
Aug 14, 2012
filing date -
Aug 29, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A substrate with spring terminals includes a substrate including a connection pad, a spring terminal whose connection portion is connected to the connection pad by a solder layer, and a resin portion formed to cover a side surface of the solder layer, thereby the failure that the spring terminal falls down is prevented.
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