RESIN MOLD

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United States of America Patent

SERIAL NO

13583171

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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To provide a resin mold which is excellent in adhesion to a substrate, excellent in release properties from a transfer material resin, further excellent in durability of the resin mold itself, and which endures repetition transfer to the transfer material resin, a resin mold of the invention is a resin mold having a fine concavo-convex structure on the surface, and is characterized in that the fluorine element concentration (Es) in a resin mold surface portion is the average fluorine element concentration (Eb) in the resin forming the resin mold or more.

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Patent Owner(s)

Patent OwnerAddress
ASAHI KASEI E-MATERIALS CORPORATIONTOKYO 101-8101

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Koike, Jun Tokyo, JP 67 511
Matsumoto, Shinji Tokyo, JP 210 3292

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