METAL CLAD CIRCUIT BOARD
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United States of America Patent
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N/A
Issued Date -
Feb 28, 2013
app pub date -
Aug 23, 2011
filing date -
Aug 23, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A metal clad circuit board includes a metal substrate. A dielectric layer is applied to the metal substrate. A conductive seed layer is printed on the dielectric layer. A conductive circuit layer is plated onto the conductive seed layer. Optionally, the conductive seed layer may be inkjet printed on the dielectric layer. Alternatively, the conductive seed layer may be pad printed on the dielectric layer. Optionally, the dielectric layer may be powder coated to the metal substrate. The dielectric layer may include polymers and fillers compression molded to the metal substrate. Optionally, the conductive circuit layer may be electroplated to the conductive seed layer. Optionally, a solder mask may be applied over the conductive circuit layer.
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