HEAT DISSIPATION DEVICE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20130056182A1
SERIAL NO

13456240

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A heat dissipation device includes a fan and a heat sink located at the air outlet of the fan. The heat sink includes a first fin set arranged at a central portion of the air outlet, and two second fin sets respectively arranged at a side portion of the air outlet. The first fin set includes a plurality of first fins with a first passage defined between each two neighboring first fins. Each of the second fin sets includes a plurality of second fins with a second passage defined between each two neighboring second fins. Each of the second fin sets defines an undercut near the air outlet of the fan. The first passages communicate with the central portion of the air outlet of the fan. Each of the undercuts of the second fin sets communicates with corresponding side portion and corresponding second passage.

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Patent Owner(s)

Patent OwnerAddress
FOXCONN TECHNOLOGY CO LTD(236)NO 3-2 CHUNG SHAN ROAD TU-CHENG DIST NEW TAIPEI 236
FURUI PRECISE COMPONENT (KUNSHAN) CO LTDNO 635 FOXCONN ROAD HI-TECH INDUSTRY PARK DEVELOPMENT DISTRICT KUNSHAN CITY JIANGSU PROVINCE

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HWANG, Ching-Bai Tu-Cheng, TW 105 976
WANG, Zhen-Yu KunShan City, CN 11 29
XIA, Ben-Fan KunShan City, CN 23 55

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