HEAT SINK WITH A STACK OF METAL LAYERS HAVING CHANNELS THEREIN
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United States of America Patent
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app pub date -
Apr 24, 2012
filing date -
Sep 3, 2011
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Abandoned
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Abstract
An apparatus, comprising a heat sink located on a surface of an electronic device, the heat sink including a plurality of metal layers wherein: at least one exterior edge of the metal layers faces the surface, the metal layers form a stack running along the surface, and the metal layers have a plurality of openings in a major surface of the metal layers, the openings configured to carry a fluid there-through.
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