Miniature MEMS condenser microphone packages and fabrication method thereof
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United States of America Patent
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Apr 15, 2014
Grant Date -
Mar 7, 2013
app pub date -
Oct 31, 2012
filing date -
Jan 20, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
MEMS microphone packages and fabrication methods thereof are disclosed. One method for fabricating a MEMS microphone package, includes providing a substrate, forming a cavity enclosed by a top cover part, wherein a housing wall part surrounds and supports the top cover part, and the substrate supports the housing wall part and the cover part, forming a MEMS sensing element and an IC chip inside the cavity, forming an opening comprising an acoustic passage connecting the cavity to an ambient space, and forming a conductive casing enclosing the top cover part and the housing wall, wherein the conductive casing is soldered to a PCB board and is electrically connected to a common analog ground lead on the PCB board.
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