BRAZING BOND TYPE DIAMOND TOOL WITH EXCELLENT CUTTABILITY AND METHOD OF MANUFACTURING THE SAME

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United States of America Patent

APP PUB NO 20130059510A1
SERIAL NO

13565449

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Abstract

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The present disclosure provides a brazing bond type diamond tool having excellent cuttability and a method of manufacturing the same. The diamond tool includes a shank having a body and a tip portion formed along an edge of the body, and a brazing bond layer formed on the tip portion of the shank to secure diamond particles with a brazing bond. The tip portion is thinner than the body and is integrally formed with the body.

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Patent Owner(s)

Patent OwnerAddress
EHWA DIAMOND INDUSTRIAL CO LTDKYUNGGIDO 447804

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHOI, Jong Suk Seoul, KR 11 48
HONG, Jae-Hyun Hwaseong-si, KR 4 28
SONG, Young Choul Osan-si, KR 3 4

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