WAFER CARRIER WITH THERMAL FEATURES
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United States of America Patent
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Issued Date -
Mar 14, 2013
app pub date -
Nov 9, 2012
filing date -
Sep 1, 2011
priority date (Note) -
Abandoned
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Abstract
A wafer carrier used in wafer treatments such as chemical vapor deposition has pockets for holding the wafers and support surfaces for supporting the wafers above the floors of the pockets. The carrier is provided with thermal control features such as trenches which form thermal barriers having lower thermal conductivity than surrounding portions of the carrier. These thermal control features promote a more uniform temperature distribution across the wafer surfaces and across the carrier top surface.
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