HIGH IO SUBSTRATES AND INTERPOSERS WITHOUT VIAS
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United States of America Patent
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N/A
Issued Date -
Mar 21, 2013
app pub date -
Sep 19, 2011
filing date -
Sep 19, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An interconnection component includes a substrate having first and second opposed major surfaces defining a thickness of less than 1000 microns and a first slot extending between the first and second surfaces, the first slot being enclosed by the substrate at the first and second surfaces. The first slot defines an edge surface between the first surface and the second surface. First conductive traces extend along the first surface and are electrically connected with first contact pads that overlie the first surface. Second conductive traces extend along the second surface and electrically connected with second contact pads that overlie the second surface. Interconnect traces extend along the edge surface of the first slot. Each interconnect trace directly connects at least one first trace with at least one second trace.
First Claim
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
INVENSAS CORP | 3025 ORCHARD PARKWAY SAN JOSE CA 95134 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Mohammed, Ilyas | Santa Clara, US | 305 | 7556 |
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Sep 21, 2024 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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