Method for producing a plurality of optoelectronic semiconductor chips

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United States of America Patent

PATENT NO 8916403
SERIAL NO

13580491

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Abstract

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A method for producing a plurality of optoelectronic semiconductor chips includes providing a carrier wafer having a first surface and a second surface opposite the first surface, wherein a plurality of individual component layer sequences spaced apart from one another in a lateral direction are applied on the first surface, the component layer sequences being separated from one another by separation trenches; introducing at least one crystal imperfection in at least one region of the carrier wafer which at least partly overlaps a separation trench in a vertical direction; singulating the carrier wafer along the at least one crystal imperfection into individual semiconductor chips.

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Patent Owner(s)

Patent OwnerAddress
OSRAM OLED GMBHWERNERWERKSTRASSE 2 REGENSBURG 93049

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dennemarck, Jens Regensburg, DE 8 23
Günther, Ewald K M Regenstauf, DE 2 9
Gmeinwieser, Nikolaus Obertraubling, DE 14 82
Kämpf, Mathias Burglengenfeld, DE 10 16

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