Hybrid circuit structure and partial backfill method for improving thermal cycling reliability of same
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United States of America Patent
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May 14, 2013
Grant Date -
Mar 21, 2013
app pub date -
Sep 19, 2011
filing date -
Sep 19, 2011
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Abstract
A method of improving thermal cycling reliability for a hybrid circuit structure requires providing at least two circuit layers, aligning two of the circuit layers vertically such that their respective circuit elements have a precise and well-defined spatial relationship, and providing an adhesive material which wicks into a portion of the space between the aligned layers so as to mitigate damage to the structure and/or interconnections that might otherwise occur due to thermal contraction mismatch between the layers. The adhesive material is required to have an associated viscosity such that, when provided under predetermined conditions, the adhesive stops wicking before reaching, and possibly degrading the performance of, the circuit elements.
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