ELECTRONIC ASSEMBLY APPARATUS AND ASSOCIATED METHODS
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United States of America Patent
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Issued Date -
Mar 21, 2013
app pub date -
Sep 7, 2012
filing date -
Sep 16, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An apparatus includes a substrate, and first and second die. The first die is assembled above the substrate. The first die includes electronic circuitry. The second die is assembled above the substrate. The second die includes electronic circuitry. The apparatus further includes first and second interconnects. The first interconnect includes a first set of copper pillars, and couples the first die to the substrate. The second interconnect includes a second set of copper pillars, and couples the second die to the first die.
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