Electronic assembly apparatus and associated methods
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United States of America Patent
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May 26, 2015
Grant Date -
Mar 21, 2013
app pub date -
Sep 7, 2012
filing date -
Sep 16, 2011
priority date (Note) -
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Abstract
A method of fabricating an electronic assembly includes fabricating first and second interconnects. The first interconnect is adapted to interconnect a first die to a substrate. The second interconnect is adapted to interconnect the first die to a second die. The method further includes assembling the first die, the second die, and the substrate together such that the first die is disposed above the substrate, and the second die is disposed below the first die.
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