MOUNTING APPARATUS, ELECTRONIC COMPONENT MOUNTING METHOD, SUBSTRATE PRODUCTION METHOD, AND PROGRAM
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United States of America Patent
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N/A
Issued Date -
Mar 28, 2013
app pub date -
Sep 11, 2012
filing date -
Sep 27, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A mounting apparatus includes a holding unit, a sensor unit, and a controller. The holding unit is configured to hold an electronic component, move toward a substrate while holding the electronic component, and mount the electronic component on the substrate. The sensor unit is configured to detect an oscillation of the holding unit. The controller is configured to judge, based on information on the oscillation detected by the sensor unit, timings at which a position of the electronic component held by the oscillating holding unit overlaps a mounting position on the substrate, and control a movement of the holding unit toward the substrate such that the electronic component is mounted on the substrate at any of the judged timings.
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