ELECTRONIC DEVICE AND IMAGE SENSOR HEAT DISSIPATION STRUCTURE
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United States of America Patent
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Issued Date -
Mar 28, 2013
app pub date -
Oct 27, 2011
filing date -
Sep 22, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An electronic device including a main board, an image sensor heat dissipation structure and a lens module is provided. The image sensor heat dissipation structure includes a heat dissipation plate, a thermal interface layer, an image sensor package and a cover glass. The heat dissipation plate is fixed to the main board. The thermal interface layer is disposed on the heat dissipation plate. The image sensor package including a circuit board, a plurality of pads, an image sensor and an encapsulant is fixed to the thermal interface layer. The circuit board has an opening. The image sensor is electrically connected to the circuit board through the pads, wherein the light receiving surface faces the opening and the back surface faces the thermal interface layer.
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