PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM THEREOF AND PRINTED CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Apr 4, 2013
app pub date -
Sep 28, 2012
filing date -
Sep 30, 2011
priority date (Note) -
Abandoned
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Abstract
[Problems] The present invention relates to a photosensitive resin composition in which a cured film obtained therefrom has good resistance to electroless gold plating and occurrence of whitening phenomenon in a solder leveling process (pre-soldering process) and an electroless gold plating process is inhibited; a cured film of the photosensitive resin composition; and a printed circuit board comprising the cured film.
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