PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM THEREOF AND PRINTED CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Apr 4, 2013
app pub date -
Sep 28, 2012
filing date -
Sep 30, 2011
priority date (Note) -
Abandoned
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Abstract
[Problems] The present invention provides a photosensitive resin composition having good resistance to electroless gold plating and excellent filling property into a through hole, from which a cured product where a defect in the outer appearance of a cured film caused by bumping in a through hole is inhibited can be obtained; a cured film of the photosensitive resin composition; and a printed circuit board comprising the cured film.
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