Light Emitting Diode Packaging Structure and Method of Fabricating the Same
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United States of America Patent
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Issued Date -
Apr 4, 2013
app pub date -
Dec 8, 2011
filing date -
Sep 29, 2011
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Abandoned
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Abstract
A method of fabricating alight emitting diode packaging structure provides a metallized ceramic heat dissipation substrate and a reflector layer, and the metallized ceramic heat dissipation substrate is bonded with the reflector layer through an adhesive. The reflector layer has an opening for a surface of the metallized ceramic heat dissipation substrate to be exposed therefrom. The reflector layer may be formed with ceramic or polymer plastic material, to enhance the refractory property and the reliability of the package structure. In addition, the packaging structure of the present invention may make use of existing packaging machine for subsequent electronic component packaging, without increasing the fabrication cost.
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