Integrated three-dimensional module heat exchanger for power electronics cooling
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United States of America Patent
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Sep 24, 2013
Grant Date -
Apr 4, 2013
app pub date -
Sep 30, 2011
filing date -
Sep 30, 2011
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Abstract
Embodiments discussed herein are directed to a power semiconductor packaging that removes heat from a semiconductor package through one or more cooling zones that are located in a laterally oriented position with respect to the semiconductor package. Additional embodiments are directed to circuit elements that are constructed from one or more modular power semiconductor packages.
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