Microstrip to airstrip transition with low passive inter-modulation
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United States of America Patent
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Nov 4, 2014
Issued Date -
N/A
app pub date -
Sep 29, 2011
filing date -
Sep 29, 2011
priority date (Note) -
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Abstract
A microstrip to airstrip transition is provided. The microstrip to airstrip transition includes a ground plane, a printed circuit board, a microstrip, a solder mask, and an airstrip. The ground plane has first and second sides. The printed circuit board has first and second sides and is disposed on the first side of the ground plane. The microstrip is disposed on a portion of the first side of the printed circuit board, and the solder mask is disposed over at least a portion of the microstrip. The airstrip is disposed over the at least portion of the solder mask, and the solder mask prevents direct contact between the microstrip and the airstrip.
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