MOLD HAVING RELEASE LAYER FOR IMPRINTING, METHOD FOR PRODUCING MOLD HAVING RELEASE LAYER FOR IMPRINTING, AND METHOD FOR PRODUCING COPY MOLD
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United States of America Patent
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Issued Date -
Apr 4, 2013
app pub date -
Mar 29, 2011
filing date -
Mar 30, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Provided is a mold having a release layer, in which the release layer is disposed in the mold which transfers a specific uneven pattern onto a molding material to be patterned by means of an imprinting method, wherein the main chain of the molecular chains of a compound contained in the release layer contains a fluorocarbons, the molecular chains of the compound have at least two adsorption functional groups that are adsorbed or bonded to the mold, the bonding energy in the adsorption functional groups that becomes the source of adsorption or bonding of the adsorption functional groups to the mold is greater than the bonding energy between one adsorption functional group and another adsorption functional group in the molecular chains of the compound, and the surface free energy of the release layer is optimized by means of heating.
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