APPARATUSES AND METHODS FOR TREATING SUBSTRATE

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United States of America Patent

APP PUB NO 20130084404A1
SERIAL NO

13606628

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Abstract

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Provided is an apparatus and method for treating a substrate, and more particularly, an apparatus and method for treating a substrate which performs a patterning process. The substrate treating apparatus includes a stage on which a substrate is placed, a discharge unit that discharges ink to form lines on the substrate placed on the stage, a solidifying unit that solidifies the discharged ink, and a transfer unit moving the stage or moving the discharge unit and the solidifying unit.

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Patent Owner(s)

Patent OwnerAddress
SEMES CO LTD77 4SANDAN 5-GIL JIKSAN-EUP SEOBUK-GU CHEONAN-SI CHUNGCHEONGNAM-DO 31040

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
PARK, Chul Ho Cheonan-si, KR 11 181

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