Acrylate polyurethane chemical mechanical polishing layer
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United States of America Patent
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Aug 20, 2013
Grant Date -
Apr 4, 2013
app pub date -
Sep 29, 2011
filing date -
Sep 29, 2011
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Abstract
A chemical mechanical polishing pad comprising an acrylate polyurethane polishing layer, wherein the polishing layer exhibits a tensile modulus of 65 to 500 MPa; an elongation to break of 50 to 250%; a storage modulus, G′, of 25 to 200 MPa; a Shore D hardness of 25 to 75; and a wet cut rate of 1 to 10 μm/min.
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