PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM THEREOF AND PRINTED CIRCUIT BOARD

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United States of America Patent

APP PUB NO 20130085208A1
SERIAL NO

13630682

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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[Problems] The present invention provides a photosensitive resin composition having good dryness to touch and excellent resistance to electroless gold plating; a cured film thereof; and a printed circuit board comprising the cured film.

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Patent Owner(s)

Patent OwnerAddress
TAIYO INK MFG CO LTDNERIMA-KU TOKYO 176-8508

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arima, Masao Hiki-Gun, JP 32 248
NORIKOSHI, Akio Hiki-Gun, JP 3 14

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