Assembly for liquid cooling electronics by direct submersion into circulated engine coolant
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United States of America Patent
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Jul 16, 2013
Grant Date -
Apr 11, 2013
app pub date -
Oct 10, 2011
filing date -
Oct 10, 2011
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Abstract
An assembly for liquid cooling electronics by direct submersion into circulated engine coolant that includes an epoxy material dispensed around leads of electronics devices in a manner effective to mechanically secure the electronics devices to the assembly and prevent engine coolant leakage around the leads, and a Parylene™ coating layer deposited in a manner effective to protect the electronic device from electrically conductive engine coolant such as ethylene glycol. Such an assembly is useful in hybrid electric vehicles that have engine coolant available from the vehicle's internal combustion engine.
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