Method for making electrical structure with air dielectric and related electrical structures
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United States of America Patent
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Sep 22, 2015
Grant Date -
Apr 11, 2013
app pub date -
Oct 5, 2011
filing date -
Oct 5, 2011
priority date (Note) -
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Abstract
A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric.
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Patent Owner(s)
| Patent Owner | Address | |
|---|---|---|
| HARRIS CORPORATION | 1025 W NASA BOULEVARD MELBOURNE FL 32919 |
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Inventor(s)
| Inventor Name | Address | # of filed Patents | Total Citations |
|---|---|---|---|
| Maloney, Robert Patrick | West Melbourne, US | 6 | 61 |
| Rendek,, Jr Louis Joseph | West Melbourne, US | 34 | 177 |
| Shacklette, Lawrence Wayne | Melbourne, US | 25 | 282 |
| Smith, David M | Sebastian, US | 120 | 2587 |
| Weatherspoon, Michael Raymond | West Melbourne, US | 20 | 80 |
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