HEATING ELEMENT MOUNTING SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR PACKAGE
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United States of America Patent
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N/A
Issued Date -
Apr 11, 2013
app pub date -
Oct 4, 2012
filing date -
Oct 7, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A heating element mounting substrate includes a substrate including a first surface and a second surface, a plurality of wiring patterns formed on the first surface of the substrate, and a plurality of filled portions including a conductive material filled in a plurality of through-holes, the plurality of through-holes penetrating through the substrate in a thickness direction. At least one of the plurality of wiring patterns has an area of not less than 30% of an area of the first surface of the substrate. The plurality of filled portions includes non-overlapping portions that extend from the plurality of wiring patterns as viewed from the first surface side of the substrate, areas of the plurality of filled portions overlapped with the plurality of wiring patterns are not less than 50% of respective areas of the corresponding wiring patterns as viewed from the second surface side of the substrate.
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