Exposed die package that helps protect the exposed die from damage
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United States of America Patent
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Sep 30, 2014
Grant Date -
Apr 11, 2013
app pub date -
Oct 10, 2011
filing date -
Oct 10, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
In one aspect of the present invention, an integrated circuit package with an exposed die and a protective housing will be described. The housing extends beyond the exposed back surface of the die to help protect it from damage. The integrated circuit package includes a lead frame and an integrated circuit die. The integrated circuit die is electrically and physically attached to the lead frame. The housing encapsulates the lead frame and the die. The housing also includes a recessed region at the bottom of the package where the back surface of the die is exposed. There is a protruding protective structure at the bottom of the package that helps to protect the die and prevent its exposed back surface from coming in contact with an external object.
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