ABLATION METHOD

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United States of America Patent

SERIAL NO

13644020

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Abstract

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An ablation method of applying a laser beam to a workpiece to perform ablation. The ablation method includes a protective film forming step of applying a liquid resin containing a powder having absorptivity to the wavelength of the laser beam to at least a subject area of the workpiece to be ablated, thereby forming a protective film containing the powder on at least the subject area of the workpiece, and a laser processing step of applying the laser beam to the subject area coated with the protective film, thereby performing ablation through the protective film to the subject area of the workpiece after performing the protective film forming step.

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Patent Owner(s)

Patent OwnerAddress
DISCO CORPORATION13-11 OMORI-KITA 2-CHOME OTA-KU TOKYO 143-8580

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KITAHARA, Nobuyasu Tokyo, JP 23 307
OHURA, Yukinobu Tokyo, JP 19 62

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