ABLATION METHOD FOR SUBSTRATE ON WHICH PASSIVATION FILM IS FORMED
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United States of America Patent
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app pub date -
Oct 4, 2012
filing date -
Oct 6, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An ablation method of applying a laser beam to a substrate on which a passivation film of nitride is formed, thereby performing ablation. The ablation method includes a protective film forming step of applying a liquid resin containing a fine powder of oxide having absorptivity to the wavelength of the laser beam to at least a subject area of the substrate to be ablated, thereby forming a protective film containing the fine powder on at least the subject area of the substrate, and a laser processing step of applying the laser beam to the subject area coated with the protective film, thereby performing ablation through the protective film to the subject area of the substrate after performing the protective film forming step.
First Claim
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
| Patent Owner | Address | |
|---|---|---|
| DISCO CORPORATION | 13-11 OMORI-KITA 2-CHOME OTA-KU TOKYO 143-8580 |
International Classification(s)
Inventor(s)
| Inventor Name | Address | # of filed Patents | Total Citations |
|---|---|---|---|
| KITAHARA, Nobuyasu | Tokyo, JP | 23 | 307 |
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| Fee | Large entity fee | small entity fee | micro entity fee |
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| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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