Method of Fabricating a Substrate Having Conductive Through Holes
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Apr 11, 2013
app pub date -
Mar 2, 2012
filing date -
Oct 11, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method of fabricating a substrate having a plurality of conductive through holes is disclosed. Release films are formed on opposite sides of a substrate, and a plurality of through holes penetrating the release films and the substrate are formed. A first metal layer is formed on the release films and the sidewall of each of the through holes prior to removing the release films and the first metal layer thereon. A second metal layer is formed on the first metal layer on the sidewalls of the through holes by electroless plating. Compared to the prior art, the method is simpler and cheaper to carry out while the conductive through holes and a surface circuit layer thereof are fabricated separately, thereby avoiding disadvantage of forming a circuit layer on the surface of the substrate too thick.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully