Semiconductor device and manufacturing method of the same

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United States of America Patent

PATENT NO 8872261
SERIAL NO

13607255

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Abstract

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A semiconductor device includes first, second, and third semiconductor layers each having multiple diffusion layers. The first direction widths of the first diffusion layers are the same. The amount of impurity within the first diffusion layers gradually increases from the bottom end towards the top end of the first semiconductor layer. The first direction widths of the second diffusion layers are the same. The amounts of impurity within the second diffusion layers are the same. The first direction widths of the third diffusion layers are narrower than the first direction widths of the first diffusion layers and the first direction widths of the second diffusion layers at the same level, and gradually become narrower from the bottom end towards the top end of the third semiconductor layer. The amount of impurity within the third diffusion layers are the same.

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Patent Owner(s)

Patent OwnerAddress
KABUSHIKI KAISHA TOSHIBA1-1 SHIBAURA 1-CHOME MINATO-KU TOKYO 1050023 ?1050023

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Irifune, Hiroyuki Hyogo-ken, JP 9 87
Kimura, Kiyoshi Hyogo-ken, JP 203 2432
Ohta, Hiroshi Hyogo-ken, JP 180 2022
Saito, Wataru Kanagawa-ken, JP 181 4068
Sumi, Yasuto Hyogo-ken, JP 25 495
Suzuki, Junji Hyogo-ken, JP 109 677

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