HIGH THERMAL PERFORMANCE 3D PACKAGE ON PACKAGE STRUCTURE
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United States of America Patent
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Issued Date -
Apr 18, 2013
app pub date -
Sep 12, 2012
filing date -
Oct 17, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A package on package (PoP) structure is disclosed. The PoP structure includes a top package and a bottom package disposed thereunder. The top package includes a first substrate and a first die mounted onto the first substrate. The first substrate has a thermal conductivity which is more than 70 W/(m×K). The bottom package includes a second substrate and a second die mounted onto the second substrate. An upper surface of the second die is in thermal contact with a lower surface of the first substrate.
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